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CHIPS Incentives Program – Commercial Fabrication Facilities

Open Date:

3/31/2023

Close Date:

TBD

Eligible Recipients:

  • Non-profit
  • Private Sector

Program Purpose:

  • Economic Development
  • Education and Workforce Development
  • Other Infrastructure

Reserved for Energy
Communities?

No

Upcoming Milestones:

Bureau/Office:

Funded by:

U.S. Department of Commerce

Overview

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first funding opportunity under the program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors.

There are three types of CHIPS Incentives available:

  • Direct Funding, which provides funding to the applicant for eligible costs and can take the form of grants, cooperative agreements, or other transactions,
  • Loans, which are direct loans from the Federal government to the applicant for eligible costs, and
  • Loan Guarantees, which are Federal guarantees of third-party loans to the applicant for eligible costs.

Related Resources

Additional information is available on the Resources page.

Funding Details

Funding Source:
Funding Type:
Loan/Grant Combination
Total Amount Available:
$113220000000.00
Limit per Applicant:
Estimated Awards:

Applicant Guidance

3-21-23: The Department of Commerce released a notice of proposed rules for the CHIPS incentives program.

Guides and Templates Released 3/27/23

Contact Information

For more application-related questions, please email apply@chips.gov. For general inquiries, email askchips@chips.gov.

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