March 31 ,2023: Pre-application (Leading-edge only) opens
March 31 ,2023: Full application (Leading-edge only) opens
May 1, 2023: Pre-application (Current-generation, mature node, and back-end) opens
June 26, 2023: Full-application (Current-generation, mature node, and back-end) opens
- Private Sector
- Economic Development
- Education and Workforce Development
- Other Infrastructure
Reserved for Energy
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first funding opportunity under the program. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors.
There are three types of CHIPS Incentives available:
- Direct Funding, which provides funding to the applicant for eligible costs and can take the form of grants, cooperative agreements, or other transactions,
- Loans, which are direct loans from the Federal government to the applicant for eligible costs, and
- Loan Guarantees, which are Federal guarantees of third-party loans to the applicant for eligible costs.
Related ResourcesAdditional information is available on the Resources page.
Total Amount Available:
Limit per Applicant:
3-21-23 The Department of Commerce released a notice of proposed rules for the CHIPS incentives program.
Guides and Templates Released 3/27/23
For more application-related questions, please email [email protected]. For general inquiries, email [email protected]chips.gov.